PCB is printed circuit board, which is the support of electronic components and the provider of electrical connection of electronic components. It plays a very important role in electronic components. Engineer Liu of Guangzhou Haolong electronics, a professional PCB connector agent, said that PCB has a variety of substrate materials, and each material has its own unique characteristics, which has a great impact on the connector. In order to let customers choose the right PCB substrate materials correctly and make PCB connectors work more smoothly and efficiently, engineer Liu analyzed the characteristics of each material one by one, For reference.

1. Gold plate

The process cost of gold-plated plate is the highest among all the plates, but it is the most stable and suitable for lead-free process among all the existing plates, especially for some electronic products with high unit price or high reliability.

2. OSP board

OSP process has the lowest cost and simple operation, but its popularity is still poor due to the need to modify the equipment and process conditions in the assembly plant and the poor reproductivity. After high temperature heating, the protective film pre coated on pad will be damaged, resulting in the reduction of solderability, especially when the substrate is re soldered, Therefore, if we need to go through another dip process, the dip end will face welding challenges.

3. Silver plate

Although "silver" itself has a strong mobility, which leads to leakage, today's "immersion silver" is not pure metal silver in the past, but "organic silver" co plated with organic matter. Therefore, it can meet the needs of future lead-free process, and its solderability life is longer than that of OSP board.

4. Gold plate

The biggest problem of this kind of substrate is the problem of "blackpad". Therefore, many large manufacturers do not agree to use it in the lead-free process, but most domestic manufacturers use this process.

5. Tin plate

This kind of substrate is easy to be polluted and scratched, and the process (flux) will cause oxidation discoloration. Most domestic manufacturers do not use this process, so the cost is relatively high.

6. Spray tinplate

Because of the low cost, good solderability, good reliability and the strongest compatibility, but this kind of solder spray plate with good solderability can not be used in the lead-free process because it contains lead.